RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.System-on-package (SoP) integration using multilayer low-temperature co-fired ceramic (LTCC) technology enables ... I¼m P-HEMT) process which features a typical drain source break down voltage of 5.5 V. This circuit diagram is shown in anbsp;...


Title:RF and Microwave Microelectronics Packaging
Author: Ken Kuang, Franklin Kim, Sean S. Cahill
Publisher:Springer Science & Business Media - 2009-12-01
ISBN-13:

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